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Senior Member IEEE
Packaging, miniaturisation and embedding of cyberphysical systems in materials, objects and structures with particular emphasis on challenging and harsh application environments.
Packaging, miniaturisation and embedding of cyberphysical systems in materials, objects and structures with particular emphasis on challenging and harsh application environments. Has been active in nationally-funded and industry-funded research and in EU collaborative programmes since 1983.
- Rojas and J. Barrett, "A Novel 3-D Embedded Module for Displacement Measurement in Metal Structures," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 11, pp. 1765-1773, Nov. 2017. doi: 10.1109/TCPMT.2017.2749278
George, J.; Compagno, T.; Rodgers, K.; Waldron, F.; Barrett, J., "Reliability of plastic-encapsulated electronic components in supersaturated steam environments," in Components, Packaging and Manufacturing Technology, IEEE Transactions on , vol.5, no.10, pp.1423-1431, Oct. 2015, doi: 10.1109/TCPMT.2015.2470596
William Quinn, Ger Kelly, and John Barrett, “Development of an embedded wireless sensing system for the monitoring of concrete”, Journal of Structural Health Monitoring”, 11(4), July 2012, pp. 381–392, doi:10.1177/1475921711430438.
David Rojas and John Barrett, “Experimental Analysis of a Wireless Sensor Network in a Multi-Chamber Metal Environment”, Proceeding of the 22nd European Wireless Conference, Oulu, Finland, 18-20 May 2016, pp. 494-99.
- George, T. Compagno, F. Waldron and J. Barrett, “Reliability Analysis of Plastic Encapsulated Coin Batteries under Harsh Environmental Conditions”, 4th Electronics Systems Integration Technologies Conference, ESTC2012, Bruges, Belgium, September 2012. DOI: 10.1109/ESTC.2012.6542109.